GIS & Mapping New York New Reviewed

Leveraging Ground-Scanning Technology to Build Understanding of Underground Infrastructure in New York City

NYC Solicitations

Information Technology and Tel

New York City, New York

Posted Sep 14, 2026
Due Nov 16, 2026
ground-scanning technology 3D data-sharing platform

About This Opportunity

Information Technology and Tel is seeking information on emergent ground-scanning technologies to develop a more complete and accurate understanding of New York City’s underground infrastructure. The effort will support the 3D Underground program, a highly secure 3D data-sharing platform for infrastructure and natural features including water and sewer pipes, gas lines, electrical conduits, fiber-optic cables, and soil composition.

This bid is 90% technology related

A strong match for technology vendors

Why we classified this as tech

This RFI seeks ground-scanning technology and a secure 3D data-sharing platform for mapping underground infrastructure, making it highly relevant to GIS, geospatial data, platform, and infrastructure technology vendors.

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Deadline: Nov 16, 2026 at 12:00 AM ET

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